نموذج: AAUS+300D-21AHR USB 2.0+3.0 fourth floor
علامة تجارية: ييفينغ
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| USB 2.0 CONTACTS(1,2,3,4 PORT): | COPPER ALLOY, G/F & MATTE TIN PLATED & NICKELPLATED |
| USB 3.0 CONTACTS(1,2,3,4 PORT): | COPPER ALLOY, G/F & MATTE TIN PLATED & NICKELPLATED |
| SHELL: | SUS304 T=0.25, MATTE PLATING ON SOLDER TAILS OVER NICKEL |
| BLACK SHELL: | SUS304 T=0.25, NO PLATED |
| MIDDLE BULLET: | SK7, NICKEL PLATED & COPPER PLATED |
| HOUSING: | PA66+30%G.F, BLUE |
| 3PORT HOUSING: | PA66+30%G.F, BLACK |
| 4PORT HOUSING: | PA66+30%G.F, BLACK |
| COVER 1: | PA66+30%G.F, BLUE |
| COVER 2: | PA66+30%G.F, BLUE |
| CONTACT CURUENT RATING: | |
| 1.8A FOR USB3.0 VBUS PIN AND ITS CORRESPONDING GEND PIN | |
| CONTACT RESISTANCE: | |
| INITIAL 30 MILLIOHMS MAX FOR VBUS AND GND CONTACTS | |
| NINTIAL 50 MILLIOHMS MAX FOR ALL OTHER CONTACTS | |
| AFTER DURABILITY 10 MILLIOHMS MAX CHANGE | |
| INSULATION RESISTANCE: | 100 MEGOHMS MIN |
| DIELECTRIC WITHSTANDING VOLTAGE: | 100 VRMS AC MIN |
| CONNECTOR MATING FORCE : | 20N MAX |
| CONNECTOR UNMATING FRCE : | 10~20N INITIAL |
| DURABILITY: | 5000 CYCLES |
| OPERATING TEMPERATURE: | -55℃~+85℃ |
| RECOMMENED PROCESS: WAVE SOLDER 260℃ 6 SECONDS | |
| THE CONNECTOR 1S ROHS AND HALOGEN FREE COMPLAINT | |
| RECOMMENED PCB THICKNESS: 1.60±0.05mm | |
| LAYER USB3.0 GEN1 | |
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